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Communication Dans Un Congrès Année : 2023

Innovative Packaging Integration Strategy for BiCMOS ICs Operating beyond 200 GHz

Résumé

In this paper, an innovative packaging integration strategy compatible with Silicon-based technologies is proposed. It is assessed beyond 200 GHz by the integration of a BiCMOS WR3 back-to-back waveguide (WG) to suspended stripline (SSL) transition in organic laminate substrate. An insertion loss below 3 dB is obtained in the 220-320 GHz band, competing with traditional solutions using III-V substrates. Achieved performances are promising and could enable sub-THz volume-manufacturing packaging solutions for Silicon technologies.
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Dates et versions

hal-04370205 , version 1 (02-01-2024)

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David Ovalle-Taylor, Frédéric Gianesello, Cyril Luxey, Guillaume Ducournau. Innovative Packaging Integration Strategy for BiCMOS ICs Operating beyond 200 GHz. 2023 53rd European Microwave Conference (EuMC), Sep 2023, Berlin, Germany. pp.6-9, ⟨10.23919/EuMC58039.2023.10290367⟩. ⟨hal-04370205⟩
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