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Communication Dans Un Congrès Année : 2023

Full Band Monte Carlo Simulation of Thermal Transport Across Lateral Interface Between 2D Materials

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hal-04333399 , version 1 (09-12-2023)

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Junbum Park, Marco Pala, Jérôme Saint-Matin. Full Band Monte Carlo Simulation of Thermal Transport Across Lateral Interface Between 2D Materials. 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Sep 2023, Kobe, Japan. pp.21-24, ⟨10.23919/SISPAD57422.2023.10319605⟩. ⟨hal-04333399⟩
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