Dual Experimental Approach for Thermal Impacts on Electromagnetic Behavior of Electronic Circuit Board Configurations
Résumé
Some effects of physical parameters, such as temperature, on electromagnetic emission or susceptibility of electronic circuit boards are nonnegligible and can be enforced by new integrated complex electronic structures. This paper describes experimental improvements proposed on near-field and radiated mode test setups, including the temperature parameter. New experimental investigations and methodology are driven to estimate
the real external thermal impacts on electromagnetic behavior and compliance. With pertinent characterization results, a review of wideband frequency modifications of electromagnetic compatibility (EMC) responses on electronic configurations with active digital devices and a printed circuit board (PCB) wire network is presented and analyzed.
Mots clés
Characterization
Electromagnetic compatibility (EMC)
Electromagnetic field
Printed circuit board (PCB)
Radiated mode
Temperature
Test setup
Thermal impact.
Temperature Electromagnetic field Characterization Printed Circuit Board Radiated mode Thermal impact Test set-up EMC
Characterization
Printed Circuit Board
Thermal impact
Test set-up
EMC
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