Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2023

Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions

Résumé

Since 2006 and the introduction of the RoHS legislation preventing the use of lead in electronic assemblies, lead-free solder alloys have gained interest amongst the industry and academics with the introduction of new solder alloy compositions. Solder joint durability has been widely studied, especially the SAC305 solder composition, one of the most common lead-free alloy used in electronic equipment. Assessing solderjoint durability can consists in performing Accelerated Temperature Cycling (ATC) tests to measure durability data. Finite Element Analysis (FEA) can also be performed in order to correlate a thermomechanical fatigue criterion, such as the inelastic strain energy density, with the durability data for different test configurations to develop a fatigue model. However, accurately calculating the inelastic strain energy density dissipated in solder interconnections during thermal cycling requires knowledge of the solder material’s behavior law. Under thermal cycling conditions, SAC305 solder behaves as a highly viscoplastic material and is often described using the Anand model.This study presents the methodology considered to determine the Anand viscoplastic model representative of actual SAC305 solder joints...
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Dates et versions

hal-04275342 , version 1 (08-11-2023)

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Jean-Baptiste Libot, Zoé Bussière, Lara Mahfouz, Joël Alexis, Olivier Dalverny. Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2023, Graz, Australia. pp.1-12, ⟨10.1109/EuroSimE56861.2023.10100843⟩. ⟨hal-04275342⟩
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