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Poster De Conférence Année : 2022

Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction

Résumé

The investigation of copper microstructure at nanoscale using synchrotron-based Laue microdiffraction technique is presented. Based on the experimental findings, FEM simulations allow to extract the plastic behaviour dependence on the orientation for the single crystals. The results obtained are used to achieve Cu/SiO2 hybrid bonding with 300 nm Cu pads.
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Dates et versions

hal-03962892 , version 1 (30-01-2023)

Identifiants

  • HAL Id : hal-03962892 , version 1

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Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Faycal Houssaini, Helene Fremont, et al.. Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction. Satellite European School for Young Scientists Microscopy and Materials Characterization, Oct 2022, Dresde, Germany. 2022. ⟨hal-03962892⟩
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