Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
Résumé
The investigation of copper microstructure at nanoscale using synchrotron-based Laue microdiffraction technique is presented. Based on the experimental findings, FEM simulations allow to extract the plastic behaviour dependence on the orientation for the single crystals. The results obtained are used to achieve Cu/SiO2 hybrid bonding with 300 nm Cu pads.
Domaines
Sciences de l'ingénieur [physics]Origine | Publication financée par une institution |
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