Candida albicans adhesion on dielectric surfaces (SiO 2) with tailored properties at low shear stresses - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2018

Candida albicans adhesion on dielectric surfaces (SiO 2) with tailored properties at low shear stresses

Fichier non déposé

Dates et versions

hal-03954974 , version 1 (24-01-2023)

Identifiants

  • HAL Id : hal-03954974 , version 1

Citer

Marvine Soumbo, Adriana Scarangella, Christina Villeneuve-Faure, A. Mlayah, C. Bonafos, et al.. Candida albicans adhesion on dielectric surfaces (SiO 2) with tailored properties at low shear stresses. Biofilms 8, May 27-29, 2018, Aarhus (DENMARK), 2018, Aarhus, Denmark. ⟨hal-03954974⟩
19 Consultations
0 Téléchargements

Partager

Gmail Facebook X LinkedIn More