Multi-switch Si-chip structures and on-substrate packaging techniques for improving the electrical performance of power modules
Résumé
Starting from the common anode and common cathode multi-switch Si-chips, this paper focuses on the different association techniques of the two power chips on the usual substrates (DBC/IMS). The study uses 3D multiphysics COMSOL simulations to determine the best association that would allow the best electrical performance of power converters.