Multi-switch Si-chip structures and on-substrate packaging techniques for improving the electrical performance of power modules - Archive ouverte HAL
Communication Dans Un Congrès Année : 2013

Multi-switch Si-chip structures and on-substrate packaging techniques for improving the electrical performance of power modules

Résumé

Starting from the common anode and common cathode multi-switch Si-chips, this paper focuses on the different association techniques of the two power chips on the usual substrates (DBC/IMS). The study uses 3D multiphysics COMSOL simulations to determine the best association that would allow the best electrical performance of power converters.
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Dates et versions

hal-03937620 , version 1 (13-01-2023)

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Citer

A. El Khadiry, Frédéric Richardeau, A. Bourennane, D. Zhifeng, M. Breil-Dupuy. Multi-switch Si-chip structures and on-substrate packaging techniques for improving the electrical performance of power modules. 15th European Conference on Power Electronics and Applications, Lille, France, Sep 2013, Lille, France. ⟨10.1109/EPE.2013.6634426⟩. ⟨hal-03937620⟩
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