Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections - Archive ouverte HAL
Proceedings/Recueil Des Communications Année : 2022
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hal-03776468 , version 1 (13-09-2022)

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Romaric Kabre, David Danovitch, Valerie Oberson, Magali Cote. Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), IEEE, pp.1395-1402, 2022, ⟨10.1109/ECTC51906.2022.00224⟩. ⟨hal-03776468⟩
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