Plastic Microwave Fibers at Millimeter-wave and THz Frequencies as a Low Cost Data Link
Résumé
A chip-to-chip, board-to-board or module-to-module interconnect is presented that offers over 100 Gbit/s datarates at a cost of a few cents per link based on polymer microwave fiber technology. The link uses a PTFE core with air cladding, connected using plastic metal-waveguide flanges. This work demonstrates that dielectric waveguides could become a key technology in enabling faster communication technology and chip-to-chip interconnects. Using OOK, QPSK and QAM16, data rates of 24 Gbit/s, 64 Gbit/s and 128 Gbit/s respectively were reached.