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Communication Dans Un Congrès Année : 2021

Titanium isotropic and anisotropic etching for MEMS applications

Résumé

Titanium (Ti) exhibits several advantages for the fabrication of microelectromechanical systems (MEMS), due to its remarkable properties such as good corrosion resistance and biocompatibility. Recent advances in titanium micromachining provide an opportunity to create such microdevices. Motivated by this opportunity, we discuss our efforts to advance Ti MEMS technology by developing a novel fluorine-based reactive ion etching (RIE) process. Bulk Ti was etched in an inductively coupled plasma (ICP) using a mixture of sulfur hexafluoride, oxygen, and argon. Etch rates and anisotropy have been investigated as a function of gas flow rates and self-bias voltage. Ti structures with smooth etched surfaces were performed isotropically and anisotropically, with vertical etch rates of 3 and 2 µm/min respectively.
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Dates et versions

hal-03388707 , version 1 (20-10-2021)

Identifiants

  • HAL Id : hal-03388707 , version 1

Citer

Rim Ettouri, Thomas Tillocher, Philippe Lefaucheux, Bertrand Boutaud, Jodie Phung, et al.. Titanium isotropic and anisotropic etching for MEMS applications. Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2021), Aug 2021, Paris, France. ⟨hal-03388707⟩
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