High Frequency Modeling of PCB Interconnects with the Thin Wire Method: some Applications Test Cases - Archive ouverte HAL Accéder directement au contenu
Communication Dans Un Congrès Année : 2019

High Frequency Modeling of PCB Interconnects with the Thin Wire Method: some Applications Test Cases

Fichier non déposé

Dates et versions

hal-03266488 , version 1 (21-06-2021)

Identifiants

Citer

Arnaud Guena, François Costa, Benoit Goral. High Frequency Modeling of PCB Interconnects with the Thin Wire Method: some Applications Test Cases. 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), Sep 2019, Granada, Spain. pp.636-640, ⟨10.1109/ICEAA.2019.8879010⟩. ⟨hal-03266488⟩
15 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More