Titanium nitride films were deposited by reactive magnetron sputtering on Si (100) wafers, glass and Ti6Al4V substrates. The film deposition was carried out in a gas mixture of Ar and N2. The nitrogen content was varied between 0 and 30 % of the total gas mixture. This variation led to the formation of different films with different microstructures. The microstructure of the Ti-N coatings presented nanocomposites with a low tendency to surface oxidation. From a pure Ti to tetragonal Ti2N and cubic Ti-N microstructures, the films showed a (111) TiN plane growth that led to an increase in the lattice strain and a decrease in the grain size when increasing the nitrogen flow rate. The water-film contact angle measurements showed that the surface hydrophobicity increased with the increase of nitrogen content in the film. Mechanical properties were measured and a strong dependence between microstructure and hardness was found. The Ti-N deposited under 20 % of N2 exhibited the highest hardness, the best adhesion and wear resistance, and the lowest friction coefficient with the presence of (111) fiber texture.