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Communication Dans Un Congrès Année : 2020

Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects

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hal-03203851 , version 1 (21-04-2021)

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B. Ayoub, S. Lhostis, S. Moreau, E. Leon Perez, J. Jourdon, et al.. Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects. 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Dec 2020, Singapore, France. pp.453-458, ⟨10.1109/EPTC50525.2020.9315028⟩. ⟨hal-03203851⟩
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