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Communication Dans Un Congrès Année : 2020

Low voltage switching cell for high density and modular 3D power module with integrated air-cooling

Résumé

This paper presents the TAPIR (compacT and modulAr Power modules with IntegRated cooling) power module technology based on dual side air-cooling, the heat sinks acting as electrodes of power devices. Used with a large number of power semiconductor devices, this technology improves the cooling performances while maintaining low stray inductances in switching cells. It is therefore suited to high-speed devices and allows increasing the density of power converters. A low-voltage switching cell is designed and electrically and thermally tested. The weight of the semiconductor and thermal management parts of a three-phase inverter made with TAPIR technology is estimated and compared with more classical packaging approaches.
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Dates et versions

hal-03145544 , version 1 (18-02-2021)

Identifiants

  • HAL Id : hal-03145544 , version 1

Citer

W F Bikinga, W Deffous, B Mezrag, A Derbey, F Dumas, et al.. Low voltage switching cell for high density and modular 3D power module with integrated air-cooling. Conference on Integrated Power Electronics Systems CIPS'20, Mar 2020, Berlin, Germany. ⟨hal-03145544⟩
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