Custom plating of nanoscale semiconductor/catalyst junctions for photoelectrochemical water splitting - Archive ouverte HAL
Article Dans Une Revue Nanoscale Année : 2021

Custom plating of nanoscale semiconductor/catalyst junctions for photoelectrochemical water splitting

Résumé

Photoelectrochemical water splitting under harsh chemical conditions can be promoted by dispersed transition metal nanoparticles electrodeposited on n-Si surfaces, without the need for classical protection layers. Although this method is simple, it only allows for poor control of metal morphology and geometry on the photoanode surface. Herein, we introduce templated nanoscale electrodeposition on photoactive n-Si for the customization of nanoscale inhomogeneous Schottky junctions and demonstrate their use as stable photoanodes. The photoelectrochemical properties of the so-manufactured photoanodes exhibit a strong dependence on the photoanodes’ geometrical features, and the obtained experimental trends are rationalized using simulation.
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Dates et versions

hal-03100848 , version 1 (11-01-2021)

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Kiseok Oh, Olivier de Sagazan, Cyril Léon, Sylvain Le Gall, Gabriel Loget. Custom plating of nanoscale semiconductor/catalyst junctions for photoelectrochemical water splitting. Nanoscale, 2021, 13 (3), pp.1997-2004. ⟨10.1039/D0NR08414J⟩. ⟨hal-03100848⟩
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