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Communication Dans Un Congrès Année : 2020

Design And Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

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hal-03020871 , version 1 (24-11-2020)

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  • HAL Id : hal-03020871 , version 1

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Said Bensebaa, Mounira Bouarroudj-Berkani, Stéphane Lefebvre, Mickael Petit. Design And Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam. PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Jul 2020, Nuremberg, Germany. ⟨hal-03020871⟩
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