A Rapid, Reliable and Less-destructive On-chip Mass Measurement for 3D Composite Material Testing Microstructures - Archive ouverte HAL Access content directly
Conference Papers Year : 2020

A Rapid, Reliable and Less-destructive On-chip Mass Measurement for 3D Composite Material Testing Microstructures

Abstract

Mass measurements of complex three-dimensional microstructures are essential to the design and development of microsystems. However, the mass measurements of such microstructures require several manipulation steps which are not well controlled. We have demonstrated a rapid, reliable and lessdestructive on-chip mass measurement method by incorporating with AFM micromanipulation. It is based on AFM pick-measureplace micromanipulation using Van der Waals attraction and the mass measurement by resonant frequency shift. The measurement sensitivity revealed to be 25 Hz/pg and it could be promising to characterize MEMS with complex geometries and composite materials.
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Dates and versions

hal-03020646 , version 1 (24-11-2020)

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Gilgueng Hwang, Christophe David, Alisier Paris, Dominique Decanini, Ayako Mizushima, et al.. A Rapid, Reliable and Less-destructive On-chip Mass Measurement for 3D Composite Material Testing Microstructures. 33rd International Conference on Microelectronic Test Structures (ICMTS 2020), May 2020, Edimbourg, United Kingdom. ⟨10.1109/ICMTS48187.2020.9107932⟩. ⟨hal-03020646⟩
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