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Communication Dans Un Congrès Année : 2020

Elastoplastic and fatigue properties of copper in printed circuit boards : from experimental characterization to numerical simulations

Résumé

In operation, a Printed Circuit Board (PCB) will face various and repeated thermomechanical loadings that may lead to the failure of the copper, and thus to the malfunction of the PCB itself. In order to simulate and better predict the reliability of PCBs, the constitutive behavior of copper has to be defined. In the present work, a 17 µm rolled annealed copper film frequently used in the flexible PCB industry has been tested under a cyclic tensile-compressive loading. The copper has a low elastic limit and plastic deformation plays thus an important role during straining. Under cyclic loadings, a predominant kinematic hardening has been observed. The plastic behavior of the studied copper film has been identified with a Lemaitre-Chaboche hardening model. Next, an original experimental setup has been developed, allowing to measure the fatigue behavior of thin copper films under cyclic loadings. Tests with various loading amplitudes are carried out. A Coffin-Manson model has been adopted to reproduce the experimental data.
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Dates et versions

hal-03009587 , version 1 (17-11-2020)

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Gautier Girard, Marion Martiny, Sebastien Mercier. Elastoplastic and fatigue properties of copper in printed circuit boards : from experimental characterization to numerical simulations. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, France. pp.1-5, ⟨10.1109/eurosime48426.2020.9152709⟩. ⟨hal-03009587⟩
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