Analytical multi-step homogenization methodology for a stack of thin films in microelectronics - Archive ouverte HAL
Conference Papers Year : 2020

Analytical multi-step homogenization methodology for a stack of thin films in microelectronics

H. Miled
  • Function : Author
Mécanique des Matériaux et Procédés
F. Roqueta
  • Function : Author
STMicroelectronics [Tours]
J. Craveur
  • Function : Author
E. Le Bourhis
  • Function : Author
Institut Pprime [UPR 3346]
P. Gardes
Abdellah Tougui
  • Function : Author
Mécanique des Matériaux et Procédés

Domains

Materials and structures in mechanics [physics.class-ph] Mechanics of materials [physics.class-ph] Solid mechanics [physics.class-ph] Structural mechanics [physics.class-ph]

Stéphane Méo  : Connect in order to contact the contributor

https://hal.science/hal-02972476

Submitted on : Tuesday, October 20, 2020-2:06:10 PM

Last modification on : Wednesday, September 11, 2024-2:10:03 PM

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hal-02972476 , version 1 (20-10-2020)

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Cite

H. Miled, F. Roqueta, J. Craveur, E. Le Bourhis, P. Gardes, et al.. Analytical multi-step homogenization methodology for a stack of thin films in microelectronics. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, Poland. pp.1-7, ⟨10.1109/EuroSimE48426.2020.9152652⟩. ⟨hal-02972476⟩

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