Impact of Inter-Tier Coupling on Static and Noise Performance in 3D Sequential Integration Technology - Archive ouverte HAL
Communication Dans Un Congrès Année : 2019

Impact of Inter-Tier Coupling on Static and Noise Performance in 3D Sequential Integration Technology

Résumé

This work presents for the first time an analytical study of the electrostatic coupling between bottom and top layer of 3D sequential integration devices, regarding its impact on both static and noise behavior. The effect is demonstrated experimentally through statistical measurements, and TCAD simulations are used to further examine its properties and propose ways for the limitation of inter-tier coupling. It is demonstrated that regarding digital applications, the coupling-induced fluctuations are well within the mismatch variation level.
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Dates et versions

hal-02969755 , version 1 (16-10-2020)

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Petros Sideris, Laurent Brunet, Gilles Sicard, Perrine Batude, Christoforos Theodorou. Impact of Inter-Tier Coupling on Static and Noise Performance in 3D Sequential Integration Technology. 2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Apr 2019, Grenoble, France. pp.1-4, ⟨10.1109/EUROSOI-ULIS45800.2019.9041871⟩. ⟨hal-02969755⟩
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