Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect - Archive ouverte HAL
Article Dans Une Revue International Symposium on Microelectronics Année : 2016
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hal-02453569 , version 1 (23-01-2020)

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C. Marsan-Loyer, D. Danovitch, N. Boyer. Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect. International Symposium on Microelectronics, 2016, 2016 (1), pp.000054-000059. ⟨10.4071/isom-2016-TP25⟩. ⟨hal-02453569⟩
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