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Communication Dans Un Congrès Année : 2019

An Analytical Model for the Optimisation of Metal Foam for Power Electronics Cooling

Résumé

With regular technological breakthroughs in power electronics, there is an ever-increasing need for efficient thermal management. This has led to an increased focus on the study of metal foam enhanced heat sinks. The aim of this paper is to develop and validate an analytical model to calculate the total thermal resistance of a metal foam filled channel. The model will then be used to optimise the microstructure of the foam in order to minimise the thermal resistance of the channel. Foams with three different porosities (40, 60 and 80%) were compared with numerical simulations and the deviation in results was found to be less than 2%. When optimised under a fixed pressure loss of 100kPa, a thermal resistance of 0.023K/W was found.
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Dates et versions

hal-02302175 , version 1 (01-10-2019)

Identifiants

  • HAL Id : hal-02302175 , version 1

Citer

Joseph Glass, Yvan Avenas, Didier Bouvard, Sébastien Ferrouillat. An Analytical Model for the Optimisation of Metal Foam for Power Electronics Cooling. Therminic 2019, Sep 2019, Lecco, Italy. ⟨hal-02302175⟩
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