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Article Dans Une Revue Microwave and Optical Technology Letters Année : 2011

Improved test structure for on-wafer microwave characterization of components

Résumé

This article presents the impact of different test structures on the results of microwave characterization of on-wafer components. In this study, we focus on the characterization and modeling of NXP Semiconductors Technology Passive Integration Connective Substrate (PICS) capacitor. First, we show the strong dependency of the extracted parameters according to test structure used when utilizing traditional open/short parasitic elements removing method. Second, we propose an optimization of the test structures to reduce their influence on the intrinsic parameters extracted from on-wafer characterization of the device under test. We also propose a way to improve the accuracy of the modeling of PICS devices in radiofrequency and microwave domains

Dates et versions

hal-02190938 , version 1 (23-07-2019)

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Philippe Descamps, Dolphin Abessolo-Bidzo, Patrick Poirier. Improved test structure for on-wafer microwave characterization of components. Microwave and Optical Technology Letters, 2011, 53 (2), pp.249-254. ⟨10.1002/mop.25738⟩. ⟨hal-02190938⟩
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