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Communication Dans Un Congrès Année : 2018

Reduction of an electronic card thermal problem by the modal sub structuring method

Résumé

The computation time needed to compute modes remains the main drawback of modal methods. This computation time can be reduced by using the sub structuring modal method. First of all, the model is divided into elementary entities, and modes of each entity are independently computed. In order to solve the original problem, only specific modes are chosen to couple sub-structures together: the Steklov modes. This method is applied to an electronic card witch supports eighteen components. The Printed Circuit Board is accurately modeled considering local thermal properties (like local copper tracks). The reduced model recovers the maximum temperature of critical component for a dynamic scenario and various boundary conditions reducing the solver time by 500.
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Dates et versions

hal-02186702 , version 1 (17-07-2019)

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  • HAL Id : hal-02186702 , version 1

Citer

Sébastien Grosjean, Frédéric Joly, Karine Vera, Alain Neveu, Eric Monier-Vinard. Reduction of an electronic card thermal problem by the modal sub structuring method. 16th International Heat Transfer Conference (IHTC 2018), Aug 2018, Beijing, China. pp.1899--1906. ⟨hal-02186702⟩
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