Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package - Archive ouverte HAL
Communication Dans Un Congrès Année : 2017
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hal-02096939 , version 1 (11-04-2019)

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  • HAL Id : hal-02096939 , version 1

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Aurore Quelennec,, Umar Shafique,, Eric Duchesne,, Helene Fremont,, Dominique Drouin,. Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package. Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017, May 2017, Lake Buena Vista, United States. ⟨hal-02096939⟩
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