Challenges and Research for High Density. Highly Integrated Microelectronic Packaging. - Archive ouverte HAL
Communication Dans Un Congrès Année : 2018

Challenges and Research for High Density. Highly Integrated Microelectronic Packaging.

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hal-02089581 , version 1 (03-04-2019)

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  • HAL Id : hal-02089581 , version 1

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David Danovitch. Challenges and Research for High Density. Highly Integrated Microelectronic Packaging.. Front End Electronics (FEE 2018), May 2018, Orford, Canada. ⟨hal-02089581⟩
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