Investigation of three-dimensional digital circuits with nanometer Josephson junctions made by Focused Ion Beam
Résumé
Fabrication processes dedicated to superconducting digital electronics were significantly improved during the last five years. These lithography-based process allow to reach nearly one million junctions per cm², opening the way to integrate more complex circuits on a single chip. Specific applications such as superconducting analogue/digital interfaces require locally an outstanding performance. The 3D FIB (Focused Ion Beam) technique allows to precisely customize specific parts by locally etching the films. The presented work is focused on modeling nanometer-size Josephson junctions made by 3D FIB from a Superconductor-Normal Metal-Insulator-Superconductor (SNIS) multi-layer process. An electrical model of the three-dimensional nano-SQUID was extracted with the InductEx© [5] software , based on physical parameters of the 3D FIB SNIS technology. Expected behavior was simulated with the SPICE-based JSIM simulator.
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