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Article Dans Une Revue Solid-State Electronics Année : 2014

Full split C–V method for parameter extraction in ultra thin BOX FDSOI MOS devices

Résumé

The feasibility of full split C–V method in ultra-thin body and BOX (UTBB) FDSOI devices is demonstrated, emphasizing the usefulness of gate-to-bulk capacitance. The split C–V measurements carried out on both gate-to-channel and gate-to-bulk mode are shown to be consistent with TCAD simulation. This enabled us to propose an improved parameter extraction methodology for the whole vertical FDSOI stack from gate to substrate using back biasing effect.

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Dates et versions

hal-01947620 , version 1 (07-12-2018)

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Minju Shin, Ming Shi, Mireille Mouis, Antoine Cros, Emmanuel Josse, et al.. Full split C–V method for parameter extraction in ultra thin BOX FDSOI MOS devices. Solid-State Electronics, 2014, 99, pp.104-107. ⟨10.1016/j.sse.2014.04.039⟩. ⟨hal-01947620⟩
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