Optimization of metallized film capacitor connection to reduce stray inductance - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue IEEE Transactions on Components Packaging and Manufacturing Technology Part B Année : 2018

Optimization of metallized film capacitor connection to reduce stray inductance

Marwan Ali
  • Fonction : Auteur
  • PersonId : 988636
Régis Meuret
  • Fonction : Auteur
  • PersonId : 839400
David Thomson
  • Fonction : Auteur
  • PersonId : 976946

Résumé

In power electronic applications, due to switching components, the inverter dc-bus generates current pulses at low and high frequencies. Usually, a dc-bus capacitor is sized to absorb the current peaks at the switching frequency, and to stabilize the DC voltage. For decoupling the high frequency (HF) harmonics, an additional capacitor is required. This decoupling capacitor needs to have a low impedance over a wide range of frequencies. However, their performances for the high frequency range are highly limited by their stray inductance. In order to minimize the need for an additional decoupling capacitor at high frequencies, this paper proposes to improve the connections of the DC bus capacitor. Busbar configuration and Printed Circuit Board (PCB) allow reducing parasitics of the cabling. Several types of interconnection are proposed and characterized in this study. Both 2-terminal and 4-terminal capacitors are evaluated and compared regarding operating frequency ranges. Measurement and modeling results show a significant improvement for HF decoupling by using quadrupole coaxial connections.
Fichier principal
Vignette du fichier
condensateur_review_2.pdf (7.3 Mo) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-01946707 , version 1 (06-12-2018)

Identifiants

Citer

Theo Penven, Christian Martin, Charles Joubert, Marwan Ali, Régis Meuret, et al.. Optimization of metallized film capacitor connection to reduce stray inductance. IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2018, pp.1-1. ⟨10.1109/TCPMT.2018.2874100⟩. ⟨hal-01946707⟩
54 Consultations
317 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More