Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability - Archive ouverte HAL
Article Dans Une Revue Microelectronics Reliability Année : 2018

Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability

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https://hal.science/hal-01885226

Soumis le : lundi 1 octobre 2018-16:45:47

Dernière modification le : mercredi 2 août 2023-16:40:25

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hal-01885226 , version 1 (01-10-2018)

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M. Balmont, I. Bord Majek, B. Poupard, L. Bechou, Y. Ousten. Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. Microelectronics Reliability, 2018, 88-90, pp.1108 - 1112. ⟨10.1016/j.microrel.2018.06.077⟩. ⟨hal-01885226⟩

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