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Communication Dans Un Congrès Année : 2018

Delphi-like dynamical compact thermal models using model order reduction based on modal approach

Résumé

The Compact Thermal Models (CTMs) became a standard for low-cost modeling of single-chip electronic packages. According with Delphi's method, their creation is time consuming since numerical simulations of a Detailed Thermal Models (DTMs) of the package have to be repeated for large sets of Robin's Boundary Conditions (BCs). Moreover Jedec standards do not provide guidance to consider multi-chip packages or to investigate the creation of multi-path transient behavioral models. The present study proposes a complementary method to create Dynamical Delphi-style CTMs (DCTMs acronym). This one promotes the replacing of the heavy computational simulations of a given detailed model by a faster reduced order model, built by the means of modal approach. At first, that multi-stage reduction method is applied with success to a single-chip package (QFN16) then to a dual-chip package (DFN12). As relevant results, the mathematical computation time is drastically shortened, which allows speeding up the DCTM creation procedure by 80%, without degrading its accuracy.
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Dates et versions

hal-01824392 , version 1 (27-06-2018)

Identifiants

Citer

Brice Rogie, S. Grosjean, Eric Monier-Vinard, Valentin Bissuel, Frédéric Joly, et al.. Delphi-like dynamical compact thermal models using model order reduction based on modal approach. 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM 2018), Mar 2018, San Jose, United States. pp.13--20, ⟨10.1109/SEMI-THERM.2018.8357347⟩. ⟨hal-01824392⟩
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