Integration solutions for clean and safe switching of high speed devices
Résumé
This paper investigates the impact of stray elements (inductance, capacitance) on the switching behavior. Voltage overshoots,
ringing, EMC, losses are under concern. Positive effects as well as negative ones in the case of very high speed
commutations are underlined, resulting in design rules for packaging. Afterwards a case study of several power modules
is proposed, showing various solutions of many authors to provide packaging solutions adapted to the new high speed devices