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Communication Dans Un Congrès Année : 2008

Temperature Levels Effects on the Thermo-Mechanical Behaviour of Solder Attach During Thermal Cycling of Power Electronic Modules

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hal-01677164 , version 1 (08-01-2018)

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  • HAL Id : hal-01677164 , version 1

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Mounira Bouarroudj-Berkani, Zoubir Khatir, Stéphane Lefebvre. Temperature Levels Effects on the Thermo-Mechanical Behaviour of Solder Attach During Thermal Cycling of Power Electronic Modules. Power Electronics Specialists Conference, 2008. PESC 2008. IEEE, Jun 2008, Rhodes, Greece. ⟨hal-01677164⟩
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