Design and Optimization of Vertical interconnections for Multilayer Optical Networks-on-Chip
Résumé
This chapter presents an overview of material platforms and vertical interconnection schemes enabling the implementation of multilayer optical networks-on-chip. Issues related to the design of staked photonic circuits, with particular regard to optical isolation, will be highlighted and discussed. Among the various interconnection solutions outlined in the text, two significant ones will be more detailed: the former exploiting directional couplers with inverse adiabatic tapers; the latter relying on multimode interference devices. Results showing the feasibility and the optimization of these approaches are presented and discussed.