Air-Filled Substrate Integrated Waveguide: a Low Cost Self-Packadged Technological Platform For High Performance Millimeterwave Circuits
Résumé
This paper presents the recently proposed air-filled substrate integrated waveguide (AFSIW) which offers a high performance technological platform for the design of self-packaged millimeterwave components and systems. AFSIW is based on low-cost multilayer printed circuit board (PCB) manufacturing process. Its performances surpasses its dielectric-filled SIW counterpart in term of transmission loss and power handling. Numerous millimeterwave passive devices operating up to 60 GHz have been studied and experimentally demonstrated. This technology is expected to contribute to the democratization of future millimeterwave extremely high data rate communications and highly sensitive sensors.