Instrumented Chip Dedicated to Semiconductor Temperature Measurements in Power Electronic Converters
Résumé
Temperature measurement of semiconductor
components is essential, in particular to evaluate performances
and to propose health monitoring of power modules.
ThermoSensitive Electrical Parameters (TSEPs) are widely used
to estimate a representative temperature of these components,
mainly in non-operating conditions, different from the real
environment of the latter (offline measurements). Nevertheless,
some TSEPs may be adapted to online temperature
measurements, in operating conditions of power converters. It is
however difficult to evaluate the accuracy of those TSEPs. This
paper presents an instrumented chip dedicated to estimate the
temperature in power electronic modules under functional
constraints. Thus, it offers a reliable and robust tool for
temperature measurements in power electronic converters.
Preliminary results presented in this paper concern the
technological process of realization and demonstrate the good
functioning of this instrumented chip under power dissipation
and switching conditions.