Integrated High-Temperature Isolation barrier with Coreless Transformer - Archive ouverte HAL
Communication Dans Un Congrès Année : 2016

Integrated High-Temperature Isolation barrier with Coreless Transformer

Résumé

A novel coreless technology based on an existing process but initially designed to produce integrated passive components for commercial temperatures, is used and its capability at 200 C is tested. Design aspects and electrical characterizations of the samples are presented. An endurance test, realized with a full modulation and demodulation prototype board, shows a satisfactory behaviour at high temperatures. Finally, a dynamic isolation test checks the coreless transformer behaviour against dV/dt perturbation. This work targets a high-temperature inverter application with high-frequency switching frequency and based on multi-chip module.
Fichier principal
Vignette du fichier
1570174283_final.pdf (5.38 Mo) Télécharger le fichier
Origine Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-01372145 , version 1 (26-09-2016)

Identifiants

  • HAL Id : hal-01372145 , version 1

Citer

Rémi Perrin, Bruno Allard, Christian Martin, Cyril Buttay. Integrated High-Temperature Isolation barrier with Coreless Transformer. 9th CIPS, Mar 2016, Nuremberg, Germany. ⟨hal-01372145⟩
123 Consultations
148 Téléchargements

Partager

More