SystemC AMS is a simulation framework, which is used for the hardware/software co-design of heterogeneous systems on chip. The increasing integration of digitally-assisted multiphysical components into these systems makes the bond graph formalism an excellent candidate to augment the modeling capabilities of SystemC AMS to enable the description of their energy-conserving behavior. Bond graphs integrate well with the block diagram formalism to describe continuous-time non-conservative behavior. The latter formalism also facilitates a seamless interaction with models using the Discrete Event (DE) and Timed Data Flow (TDF) models of computation of SystemC AMS. Therefore, both formalisms have been implemented into a dedicated Bond Graph (BG) model of computation for SystemC AMS, which architecture and usage is presented. The system model of a vibration sensor and its digital front end serves as an example how the different models of computation can be used in parallel to describe the individual component behaviors in a well adapted way.