This paper deals with the integration of power converters. The proposed integration approach combines both monolithic integration in silicon and hybrid integration on a DBC/PCB substrate. This new approach allows to devise new power converter assemblies that are of higher performance and reliability as compared to the conventional one. In this paper we present the « two-chip » multi-pole integration approach that integrates a multi-phase converter within two generic monolithic macro-chips. To validate the approach, a common anode macro-chip and two RC-IGBTs were judiciously assembled on PCB substrate to realize a first setup designed as a H-bridge generic converter. First characterization results of the converter are provided in static and switching modes.