High Temperature Discrete Integrated Coreless Signal Insulator - Archive ouverte HAL
Communication Dans Un Congrès Année : 2014

High Temperature Discrete Integrated Coreless Signal Insulator

Résumé

For a few years now, some industrialists have been proposing commercial devices to realize the insulation of control signals in power conversion systems. Those devices have been used widely in the field with entire satisfaction. However, for some applications where extreme temperature requirements must be met, those components may not be adequate. In this paper, a discrete solution is presented using three chips: a transmitter, a coreless transformer and a receiver. The transformer chip is built using a copper on glass technology while transceivers and receivers use Silicon On Insulator. Operation with a Pulse Width Modulated signal is presented, the coreless technology was tested at 200°C.
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Dates et versions

hal-01191402 , version 1 (01-09-2015)

Identifiants

  • HAL Id : hal-01191402 , version 1

Citer

Dominique Bergogne, Christian Martin, Bruno Allard, El Khalil, Gonzalo Picun, et al.. High Temperature Discrete Integrated Coreless Signal Insulator. 8th CIPS, VDE, Feb 2014, Nuremberg, Germany. ⟨hal-01191402⟩
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