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Communication Dans Un Congrès Année : 2015

3-Dimentional and High-Performance Air-Filled SIW Devices for Millimeter-Wave Substrate Integrated Circuits and Systems

Résumé

Emerging millimeter-wave frequency applications require high performance, low-cost and compact components and circuits. This is why Substrate Integrated Waveguide (SIW) technology, which combines advantages of planar circuits and non-planar metallic waveguides, has attracted much attention in recent years. However, not all three-dimensional metallic waveguide components and circuits are required to be made in planar form. In its first section, this paper reviews recently proposed three-dimensional SIW components that take advantages of the third-dimension to achieve either more compact or multi-dimensional circuits at millimeter-wave frequencies. Also in the second section, a special interest is oriented to the recent development of air-filled SIW techniques based on low-cost multilayer printed circuit board (PCB) for high-performance millimeter-wave substrate integrated circuits (SICs) and systems.
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Dates et versions

hal-01158177 , version 1 (29-05-2015)

Identifiants

  • HAL Id : hal-01158177 , version 1

Citer

Anthony Ghiotto, Ali Doghri, Frédéric Parment, Tarek Djerafi, Tan-Phu Vuong, et al.. 3-Dimentional and High-Performance Air-Filled SIW Devices for Millimeter-Wave Substrate Integrated Circuits and Systems. IEEE Global symposium on millimeter-waves, May 2015, Montreal, Canada. ⟨hal-01158177⟩
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