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Article Dans Une Revue Journal of Materials Science: Materials in Electronics Année : 2014

Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder

Résumé

Interfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250 °C is studied for the first time. The reaction product formed at the e-Cu3Sn/liquid Sn interface consists of the single g-Cu6Sn5 phase. The growth kinetics of the g phase formed at the incremental e/liquid Sn couple (e/g/Sn configuration) is compared to that of g phase formed at the classical Cu/liquid Sn couple (Cu/e/g/Sn configuration). The experimental method con- sists first in processing of intimate interfaces by dipping peaces of solid e-Cu3Sn compound and Cu in liquid Sn for 1 s at 250 °C. Afterwards, isothermal holding of such pre- performed couples for 10, 30, 120 and 480 min at 250 °C are performed for both couples. A theoretical analysis of the growth kinetics of g phase and comparison of its in both configurations are performed.

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Matériaux
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Dates et versions

hal-01138839 , version 1 (02-04-2015)

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Oleksii Liashenko, Andriy M. Gusak, Fiqiri Hodaj. Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder. Journal of Materials Science: Materials in Electronics, 2014, 25 (10), pp.4664-4672. ⟨10.1007/s10854-014-2221-7⟩. ⟨hal-01138839⟩
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