Substrate bonding using electroplated copper through silicon vias for VCSEL fabrication
Résumé
We present a novel approach to bound any substrate on a silicon host platform, in the particular case of the realization of InP based vertical cavity surface emitting lasers (VCSEL). This process is based on a mechanical bonding, using electroplated copper through silicon vias. It enables a cost effective bonding with a low induced stress, and a significant improvement of the device thermal properties. Preliminary results are presented on the realization of light emitting diodes.
| Origine | Fichiers produits par l'(les) auteur(s) |
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