Formation and use of palladium(II)–thiol complexes at the surface of PDMS stamps for the fabrication of high resolution and high density metal patterns using soft-lithography techniques - Archive ouverte HAL
Article Dans Une Revue Colloids and Surfaces A: Physicochemical and Engineering Aspects Année : 2015

Formation and use of palladium(II)–thiol complexes at the surface of PDMS stamps for the fabrication of high resolution and high density metal patterns using soft-lithography techniques

Jérémy Coulm
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Didier Léonard

Résumé

Palladium(II)–thiol complexes were synthetized at the surface of patterned PDMS stamps and were transferred onto the surface of numerous substrates using microcontact printing (μCP) and submerged microcontact printing (SμCP). These complexes were used for the fabrication of micro- and nano-scale metal patterns following both top-down and bottom-up processes. For top-down processes, palladium(II)–thiol complexes were used as mask for wet chemical etching. For bottom-up processes, palladium(II)–thiol complexes were transferred onto silanized silicon wafers and plasma-treated polymers. Plasma post-treatments under reducing conditions led to palladium nanoparticles down to 10 nm in diameter. These nanoparticles were then used as catalysts for the electroless deposition of copper or nickel patterns. Patterns of 200 nm wide metal dots (high resolution) with a period of 400 nm (high density) can be obtained.
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Dates et versions

hal-01097722 , version 1 (21-12-2014)

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Jérémy Coulm, Didier Léonard, Cédric Desroches, François Bessueille. Formation and use of palladium(II)–thiol complexes at the surface of PDMS stamps for the fabrication of high resolution and high density metal patterns using soft-lithography techniques. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2015, 466, pp.75-84. ⟨10.1016/j.colsurfa.2014.10.057⟩. ⟨hal-01097722⟩
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