Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances - Archive ouverte HAL Accéder directement au contenu
Article Dans Une Revue Microelectronic Engineering Année : 2010

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hal-01067591 , version 1 (23-09-2014)

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O. Dubreuil, V. Caubet-Hilloutou, J. Guillan, K. Haxaire, M. Mellier, et al.. Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances. Microelectronic Engineering, 2010, 87 (3), pp.421-425. ⟨10.1016/j.mee.2009.07.002⟩. ⟨hal-01067591⟩
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