FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint - Archive ouverte HAL
Communication Dans Un Congrès Année : 2014

FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

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Electronique
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hal-01020090 , version 1 (07-07-2014)

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  • HAL Id : hal-01020090 , version 1

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W. Chenniki, I. Bord-Majek, B. Levrier, K. Wongtimnoi, Jl. Diot, et al.. FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint. Micro/Nano Electronics Packaging and Assembly, Design and Manufacturing Forum (MINAPAD), May 2014, Grenoble, France. ⟨hal-01020090⟩
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