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Communication Dans Un Congrès Année : 2013

Performance of Molding Materials and Interconnections Integrated in Interposers Dedicated to RF or Microwave 3DIC applications

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hal-01018432 , version 1 (04-07-2014)

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  • HAL Id : hal-01018432 , version 1

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T. Lacrevaz, C. Bermond, B. Fléchet, Y. Lamy, O. El Bouayadi, et al.. Performance of Molding Materials and Interconnections Integrated in Interposers Dedicated to RF or Microwave 3DIC applications. European Microelectronics Packaging Conference (EMPC), Sep 2013, Grenoble, France. pp.1-7. ⟨hal-01018432⟩
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