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Communication Dans Un Congrès Année : 2013

3D Integration of CMOS Image Sensor with Coprocessor Using TSV last and Micro-Bumps Technologies

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hal-01018405 , version 1 (04-07-2014)

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  • HAL Id : hal-01018405 , version 1

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P. Coudrain, Dominique Henry, A. Berthelot, J. Charbonnier, S. Verrun, et al.. 3D Integration of CMOS Image Sensor with Coprocessor Using TSV last and Micro-Bumps Technologies. IEEE 63rd Electronic Components and Technology Conf., May 2013, Las Vegas, United States. pp.674-682. ⟨hal-01018405⟩
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