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Communication Dans Un Congrès Année : 2013

Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique

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hal-00988257 , version 1 (07-05-2014)

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  • HAL Id : hal-00988257 , version 1

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Benoît Thollin, Laurent Dupont, Zoubir Khatir, Yvan Avenas, Jean-Christophe Crébier, et al.. Partial Thermal Impedance Measurement for Die Interconnection Characterization by a microsecond "Pulsed Heating Curve Technique. EPE'13 ECCE Europe, 2013, Lille, France. ⟨hal-00988257⟩
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